Interconnect module for both panel and mid board mounting

ABSTRACT

An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

CROSS-REFERENCE TO RELATED APPLICATIONS

This claims priority to U.S. Patent Application Ser. No. 62/413,377filed Oct. 26, 2016, the disclosure of which is hereby incorporated byreference as if set forth in its entirety herein.

BACKGROUND

The explosive growth of the Internet has fueled demand for higherbandwidth and connectivity in the systems and components that supporthigh bandwidth data transmission and switching. The servers and switchesthat enable Internet communication are often configured in electronicracks connected by front panel mounted cables, which connect theindividual servers and switches together. As the connectivity andbandwidth requirements have increased mid board or on-boardinterconnection systems have been developed. These systems overcome someof the bandwidth and physical constraints of front panel mountedsystems. Recently, an effort has been made to standardize the mid boardinterconnect solutions by the Consortium for On-Board Optics (COBO)standards committee. This committee is developing a multi-sourceagreement to standardize mid board interconnect solutions.

U.S. Pat. No. 9,374,165 describes a plurality of interconnect systems,and describes with respect to FIGS. 15A-16B of U.S. Pat. No. 9,374,165an example of one of several embodiments of a transceiver that caninclude an optical engine, and a cable connected to the optical engine.U.S. Pat. No. 9,374,165 is hereby incorporated by reference as if setforth in its entirety herein. Examples of optical engines are disclosedin U.S. Pat. Nos. 7,329,054, 7,648,287, 7,766,559, 7,824,112, U.S.Patent Application Publication No. 2008/0222351, U.S. Patent ApplicationPublication No. 2011/0123150, and U.S. Patent Application PublicationNo. 2011/0123151, the entirety of each of which is hereby incorporatedby reference as if set forth in its entirety herein. Some of theembodiments described in the above references are compatible with thedeveloping COBO standards.

As described in U.S. Pat. No. 9,374,165, and also as illustrated atFIGS. 1A-1C, the cable 116 can include one or more fiber optic cablesalone or in combination with one or more copper cables. The transceiver115 can include a interconnect substrate 113 and an optical engine thatcan be mounted onto the interconnect substrate 113. The interconnectsubstrate 113 can be configured as a first printed circuit board. Theoptical engine is configured to receive optical signals from the cable116, and convert the optical signals to electrical signals. Further, theoptical engine is configured to receive electrical signals, convert theelectrical signals to optical signals, and transmit the optical signalsalong the cables. The interconnect substrate 113 can include an IC chip115 f (FIG. 6C of U.S. Pat. No. 9,374,165) that is configured to routeand/or modify the electrical signals transmitted to and from thetransceiver, including conditioning the electrical signals for protocolspecific data transfers.

The interconnect system further includes a first electrical connector152 and a second electrical connector 154 that are mounted onto a hostsubstrate 118, such as a second printed circuit board. The interconnectmodule 102 is configured to mate with both the first electricalconnector 152 and the second electrical connector 154. In particular,the first electrical connector 152 can include an electricallyinsulative first connector housing 148 and a plurality of firstelectrical contacts 150 supported by the first connector housing 148.The second electrical connector 154 can include an electricallyinsulative second connector housing 153 and a plurality of secondelectrical contacts 155 supported by the second connector housing 153.The second electrical contacts 155 can be configured as compressioncontacts that define respective mating regions 157. Thus, theinterconnect substrate 113 can be brought down onto the mating regions157 so as to compress against the second electrical contacts 155 andmate the interconnect module 102 with the second electrical connector154. Thus, the second electrical connector 154 can be referred to as anelectrical compression connector. In one example, the interconnectsubstrate can be inserted into the first electrical connector 152 at anangle relative to the host substrate 118, and then the interconnectmodule 102 can be brought down against the first electrical connector152. Alternatively, the interconnect substrate 113 can be translatedalong a direction parallel to the host substrate 118 while orientedparallel to the host substrate 118 in order to mate to each of the firstand second electrical connectors 152 and 154.

During operation, optical signals received by the interconnect module102 from the cable 116 are converted to electrical signals. Ones of theelectrical signals are routed to the first electrical connector 152,while others of the electrical signals are routed to the secondelectrical connector 154. For instance, high speed electrical signalscan be routed to the first electrical connector, and low speedelectrical signals can be routed to the second electrical connector. Forinstance, the first electrical connector can be configured to transmitelectrical signals at data transfer speeds of at least 10 Gigabits persecond. Electrical power can also be routed to the second electricalconnector. Conversely, electrical signals received by the interconnectmodule 102 from the first and second electrical connectors 152 and 154are converted into optical signals and output along the optical cablesof the cable 116. Thus, the interconnect module 102 can be configured asa transceiver. Of course, in embodiments whereby the cable includeselectrically conductive cables, the interconnect module 102 isconfigured to receive electrical signals from the electricallyconductive cables, and transmit electrical signals to the cable 116.Various ones of the electrical signals are routed to the firstelectrical connector, and various others of the electrical signals arerouted to the second electrical connector. Of course, if the cable 116includes only electrical cables, the transceiver could be providedwithout the optical engine.

The first electrical connector 152 can be mounted to the host substrate118 at a location spaced in a forward direction from a location wherethe second electrical connector 154 is mounted to the host substrate118. Similarly, the second electrical connector 154 is spaced from thefirst electrical connector 152 in a rearward direction opposite theforward direction. Thus, the first electrical connector 152 can bereferred to as a front electrical connector, and the second electricalconnector 154 can be referred to as a rear electrical connector. In oneexample, the transceiver substrate 113 is mated to the first electricalconnector 152 in the forward direction, thereby establishing anelectrical connection between electrical contacts of the firstelectrical connector and electrically conductive lands of thetransceiver substrate 113. The first electrical connector 152 can beconfigured as a right-angle electrical connector. Next, the transceiversubstrate 113 can be mated with the second electrical connector 154 bybringing electrically conductive lands on the bottom side of thetransceiver substrate 113 onto vertical compression electrical contactsof the second electrical connector 154, which can be configured as acompression connector.

SUMMARY

In accordance with one aspect of the present disclosure, an interconnectmodule can be configured to mate with a host module having a hostsubstrate and first and second pluralities of electrical contactssupported by the host module. The interconnect module can include aninterconnect substrate that defines atop and bottom surfaces oppositeeach other along a transverse direction, and front and rear endsopposite each other along a longitudinal direction that is orientedsubstantially perpendicular to the transverse direction. Theinterconnect module can further include a plurality of first electricallands carried by the bottom surface. The interconnect module can furtherinclude a plurality of second electrical lands carried by the bottomsurface disposed such that the first electrical lands are spaced fromthe second electrical lands in a forward direction that is orientedalong the longitudinal direction. The interconnect module can furtherinclude a first guide member configured to engage a second guide memberof a panel so as to guide the interconnect module to mate with a hostmodule in the forward direction such that 1) the first lands pass by thesecond electrical contacts while spaced from the second electricalcontacts along the transverse direction, 2) the first lands mate withthe first electrical contacts, and 3) the second lands mate with thesecond electrical contacts.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description will be better understood when readin conjunction with the appended drawings, in which there is shown inthe drawings example embodiments for the purposes of illustration. Itshould be understood, however, that the present disclosure is notlimited to the precise arrangements and instrumentalities shown. In thedrawings:

FIG. 1A is a side elevation view of a conventional interconnect systemincluding an interconnect module shown mated to a host module;

FIG. 1B is a perspective view of one example of the interconnect moduleof FIG. 1A;

FIG. 1C is a perspective view of another example of the interconnectmodule of FIG. 1A;

FIG. 2 is a perspective view of an interconnect system including hostmodule, and an interconnect module mated with the host module through apanel in a cage;

FIG. 3A is an exploded perspective view of the interconnect systemillustrated in FIG. 2;

FIG. 3B is another exploded perspective view of the interconnect systemillustrated in FIG. 3A;

FIG. 4 is a perspective view of the host module illustrated in FIG. 2;

FIG. 5A is a perspective view of the interconnect module illustrated inFIG. 2;

FIG. 5B is another perspective view of the interconnect moduleillustrated in FIG. 5A;

FIG. 6A is a perspective view of the cage illustrated in FIG. 2;

FIG. 6B is a perspective view of the cage illustrated in FIG. 6A;

FIGS. 7A-7F are side elevation views of the interconnect system showingthe interconnect module being mated to the host module;

FIG. 8A is a side elevation view of the interconnect system constructedin accordance with an alternative embodiment showing the interconnectmodule aligned to be mated with the host module;

FIG. 8B is a side elevation view of the interconnect system illustratedin FIG. 8A showing the interconnect module mated with the host module;

FIG. 9A is a side elevation view of the interconnect system constructedin accordance with an alternative embodiment showing the interconnectmodule aligned to be mated with the host module;

FIG. 9B is a side elevation view of the interconnect system illustratedin FIG. 9A showing the interconnect module mated with the host module;

FIG. 10A is a perspective view of the interconnect system illustrated inFIG. 2, but showing an interconnect module mated to the host module at amid board location of the host substrate; and

FIG. 10B is a schematic side elevation view of a module housing of theinterconnect module illustrated in FIG. 10A.

DETAILED DESCRIPTION

The present disclosure recognizes that it can be desirable to mate aninterconnect module through a panel to a host module that includes firstand second electrical connectors. The host module can further include ahost substrate to which the first and second electrical connectors aremounted. The host substrate can be maintained in a fixed positionrelative to the panel. In one example of the present disclosure, aninterconnect system can include a guidance system that causes theelectrical lands of the interconnect module that mate with the firstelectrical connector to travel past the second electrical connectorwithout wiping against the electrical contacts of the second electricalconnector.

The present disclosure further recognizes that it may be desirable tomate the interconnect module to a host module at a mid board location ofthe host substrate (i.e. inwardly spaced from an outer perimeter of thehost substrate). It would be advantageous to have an interconnectionsystem compatible with both panel and mid board mounting. Thus, theinterconnect module can be configured to selectively form electricalconnections to a host substrate either along the edge of the substratethrough a panel or at a mid board location of the host substrate.

Referring initially to FIGS. 2-3B, an interconnect system 200 caninclude at least one interconnect module 202, at least one panel 204,and at least one host module 206. The interconnect module 202 isconfigured to be mounted through the panel 204 (for instance through acage) and mated to the host module 206. In particular, the host module206 includes a host substrate 208, at least one electrical connectormounted to the host substrate 208. The host substrate 208 can beretained at a fixed location with respect to the panel 204. In thisregard, the host substrate 208 can be referred to as a panel-mount hostsubstrate 208. In one example, the host substrate 208 can be attached tothe panel 204. Alternatively, the host substrate 208 can be supportedrelative to the panel 204 by any suitable alternative structure asdesired.

The host module 206 can include at least one first electrical connector210 mounted to the host substrate 208, and at least one secondelectrical connector 212 mounted to the host substrate 208.Alternatively, the first and second electrical connectors 210 and 212can be mounted to respective first and second host substrates that areseparate from each other. The first and second host substrates can be inelectrical communication with each other or electrically isolated fromeach other as desired. The first electrical connector 210 can beconfigured to transmit data at higher speeds than the second electricalconnector 212. The second electrical connector 212 can be furtherconfigured to transmit electrical power. The interconnect module 202 isconfigured to be mounted to the panel 204 and mated to each of the firstand second electrical connectors 210 and 212 of the host module 206. Aswill be appreciated from the description below, interconnect system 200can be configured to guide the interconnect module 202 within the hostmodule 206 as the interconnect module 202 is mounted to the panel 204.In particular, the interconnect system 200 can further include a cage214 that is configured to be mounted to the host substrate 208, and alsoextend through the panel 204. The interconnect module 202 is configuredto be inserted into the cage 214 so as to mount to the panel 204. As theinterconnect module 202 is mounted to the panel 204, it is guided by thecage 214 into a mated position with the first and second electricalconnectors 210 and 212 of the host module 206.

Referring to FIG. 4 in particular, and as described above, the hostmodule 206 can include the host substrate 208 and at least oneelectrical connector that is mounted to the host substrate 208. The hostsubstrate 208 can be configured as a printed circuit board. In oneexample, the at least one electrical connector can include at least onefirst electrical connector 210 and at least one second electricalconnector 212 that are each mounted onto the host substrate 208. Thefirst and second electrical connectors 210 and 212 can be spaced fromeach other along a longitudinal direction L. The first and secondelectrical connectors 210 and 212 can further be at least partiallyaligned with each other along the longitudinal direction L. Thus, astraight line oriented along the longitudinal direction can pass througheach of the first electrical connector 210 and the second electricalconnector 212. The first electrical connector 210 can be spaced from thesecond electrical connector 212 in a forward direction. Conversely, thesecond electrical connector 212 can be spaced from the first electricalconnector 210 in a rearward direction that is opposite the forwarddirection. The forward direction and the rearward direction can each beoriented along the longitudinal direction L.

The host substrate 208 can define a first end 207 a and a second end 207b that is opposite the first end 207 a along the longitudinal directionL. In particular, the first end 207 a can be spaced from the second end207 b in the forward direction. Similarly, the second end 207 b can besaid to be spaced from the first end 207 a in the rearward direction.Thus, the first end 207 a can be referred to as a front end, and thesecond end 207 b can be referred to as a rear end. The forward andrearward directions can each be oriented along the longitudinaldirection L. The first electrical connector 210 can be mounted to thehost substrate 208 adjacent the first end 207 a, and the secondelectrical connector 212 can be mounted to the host substrate 208adjacent the second end 207 b. The second electrical connector 212 canbe spaced from the second edge 207 b a respective distance along thelongitudinal direction L that is less than the distance that the firstand second electrical connectors 210 and 212 are spaced from each otheralong the longitudinal direction L. During operation, second edge 207 bof the host substrate 208 can face the panel 204. For instance, incertain examples the second edge 207 b of the host substrate 208 canabut the panel 204.

The first electrical connector 210 includes an electrically insulativefirst connector housing 216 and a first plurality of electrical contacts218 that are supported by the first connector housing 216. For instance,mating regions of the first plurality of electrical contacts 218 can bearranged in at least one row that is oriented along a lateral directionA. The lateral direction A can be oriented substantially perpendicularto the longitudinal direction L. In one example, the mating regions ofthe electrical contacts 218 can be arranged in top and bottom rows offirst electrical contacts 218 that are spaced from each other along atransverse direction T that is oriented substantially perpendicular tothe each of the longitudinal direction L and the lateral direction A.The term “substantially” as used herein with respect to directionalterms recognizes that the directions may be offset due to, for instance,manufacturing tolerances. The top row of the mating regions of the firstelectrical contacts 218 can be spaced from the bottom row of the matingregions of the first electrical contacts 218 in an upward direction Tthat is oriented along the transverse direction. The upward directioncan extend away from the host substrate 208. Thus, the bottom row of themating regions of the first electrical contacts 218 can be disposedbetween the top row of the mating regions of the first electricalcontacts 218 and the host substrate 208.

The first electrical connector 210 can be configured as described abovewith respect to the first electrical connector 152 illustrated in FIG.1A. Thus, the first electrical connector 210 can define a mating end 211a that is configured to mate with the interconnect module 202 so as toplace the electrical contacts 218 in electrical communication with theinterconnect module 202. For instance, the first connector housing 216can define a receptacle 220 at the mating end 211 a that is configuredto receive the interconnect module 102 so as to mate the interconnectmodule 102 with the first electrical connector 210. The first electricalconnector 210 further defines a mounting end 211 b that is configured tobe mounted to the host substrate 208 so as to place the electricalcontacts 218 in electrical communication with the host substrate 208.The first electrical connector 210 can be configured as a right-angleconnector as illustrated. Alternatively, the first electrical connector210 can be configured as a vertical connector as desired.

The second electrical connector 212 can be configured as described abovewith respect to the second electrical connector 154 illustrated in FIG.1A. Thus, the second electrical connector can include an electricallyinsulative second connector housing 222 and a second plurality ofelectrical contacts 224 that are supported by the second connectorhousing 222. For instance, the second plurality of electrical contacts224 can be arranged in at least one row that is oriented along thelateral direction A. The second electrical connector 212 further definesa mating end 213 a that is configured to mate with the interconnectmodule 202 so as to place the electrical contacts 224 in electricalcommunication with the interconnect module 202, and a mounting end 213 bthat is configured to be mounted to the host module 108 so as to placethe electrical contacts 224 in electrical communication with the hostmodule 108. For instance, the second plurality of electrical contacts224 can extend out of from the second connector housing 222 along thetransverse direction T. In particular, the second plurality ofelectrical contacts 224 can define mating regions 225 that extend fromthe second connector housing 222 in an upward direction away from thehost substrate 208. Thus, electrically conductive lands of theinterconnect module 202 can be brought onto the mating regions 225 ofrespective ones of the second plurality of electrical contacts 224 in adownward direction, so as to mate the interconnect module 202 with thesecond electrical connector 212. The second electrical connector 212further defines a mounting end 213 b that is configured to be mounted tothe host substrate 208 so as to place mounting ends of the electricalcontacts 224 in electrical communication with the host substrate 208.

The terms “upward,” “upper,” “up,” “above,” and derivatives thereof areused herein with reference to the upward direction. The terms“downward,” “lower,” “down,” “below,” and derivatives thereof are usedherein with reference to the downward direction. Of course, it should beappreciated that the actual orientation of the interconnect system 200can vary during use, and that the terms upward and downward and theirrespective derivatives can be consistently used as described hereinregardless of the orientation of the interconnect system 200 andcomponents thereof during use.

While the first electrical contacts 218 and the second electricalcontacts 224 can be supported by first and second connector housings 216and 222 as described above, it should be appreciated that the first andsecond electrical contacts 218 and 224 can alternatively be included ina single electrical connector. Thus, the first and second electricalcontacts 218 and 224 can be supported by a single monolithic connectorhousing. It should thus be appreciated that the host module 206 caninclude first and second pluralities of electrical contacts 218 and 224,respectively, that are supported by the host substrate 208. Inparticular, the first and second pluralities of electrical contacts 218and 224 can be supported by at least one electrically insulativeconnector housing that, in turn, is mounted to the host substrate 208.In one example, the host module 206 can include a single electricalconnector having a connector housing that supports both the first andsecond pluralities of electrical contacts 218 and 224. Otherwise stated,the connector housing of the first electrical connector 210 can bemonolithic with the connector hosing second electrical connector 212.Alternatively, the host module 206 can include the first and secondelectrical connectors 210 and 212 having respective connector housingsthat are separate from each other as described above. In each of theseexamples, it can be said that the first and second pluralities ofelectrical contacts 218 and 224 are supported by the host substrate 208.For instance, the first and second pluralities of electrical contacts218 and 224 can be mounted to the host substrate 208.

The host module 206 can be configured such that the first electricalconnector 210 is configured to route high speed electrical signalsbetween the host substrate 208 and the interconnect module 102. Thesecond electrical connector 212 can be configured to route low speedelectrical signals between the host substrate 208 and the interconnectmodule 102. Thus, electrical signals can be routed through the firstelectrical connector 210 at a first maximum data transfer rate, andelectrical signals can be routed through the second electrical connector212 at a second maximum data transfer rate that is less than the firstmaximum data transfer rate. In one example, the first electricalconnector 210 can be configured to transmit electrical signals at datatransfer speeds of at least 10 Gigabits per second. Electrical power canalso be routed through the second electrical connector 212. While thefirst electrical connector 210 may be configured to receive high speedelectrical signals, and the second electrical connector 212 may beconfigured to receive low speed electrical signals, power signals, orboth it should be appreciated that the first and second electricalconnectors 210 and 212 can be alternatively configured as desired.

Referring now to FIGS. 5A-5B, the interconnect module 202 can include aninterconnect substrate 226 that defines a top surface 227 a and a bottomsurface 227 b that is opposite the top surface 227 a along thetransverse direction T. The top surface 227 a can be said to be spacedfrom the bottom surface 227 b in an upward direction, and the bottomsurface 227 b can be said to be spaced from the top surface 227 a in adownward direction that is opposite the upward direction. Theinterconnect substrate 226 can further define a first end 228 a and asecond end 228 b that is opposite the first end 228 a along thelongitudinal direction L. In particular, the first end 228 a can bespaced from the second end 228 b in the forward direction. Similarly,the second end 228 b can be said to be spaced from the first end 228 ain the rearward direction. Thus, the first end 228 a can be referred toas a front end, and the second end 228 b can be referred to as a rearend. The interconnect substrate 226 can also be referred to as a firstsubstrate. The host substrate 208 can be referred to as a secondsubstrate. The interconnect substrate 226 can be configured as a printedcircuit board.

The interconnect module 202 can include a first plurality ofelectrically conductive members that can be configured as firstelectrical lands 229 that are carried by the interconnect substrate 226.For instance, the lands 229 can be disposed proximate to the first end228 a of the interconnect substrate. In this regard, it should beappreciated that the first end 228 a can define an edge card configuredfor reception in the receptacle 220 of the first electrical connector210 so as to mate the interconnect substrate 226 with the firstelectrical connector 210. In one example, the lands 229 can be arrangedin a top row that is carried by the top surface 227 a. The lands 229 canfurther be arranged in a bottom row that is carried by the bottomsurface 227 b. The top row of lands 229 and the bottom row of lands 229can be aligned with each other along the transverse direction T. Thelands 229 of each row can be aligned with each other along the lateraldirection A. The electrical lands 229 can be configured to mate withrespective ones of the electrical contacts 218 of the first electricalconnector 210 when the interconnect module 202 is mated with the firstelectrical connector 210. In particular, a front edge of theinterconnect substrate 226 can be inserted into the receptacle 220 ofthe first electrical connector 210 so as to cause the interconnectmodule 202 to mate with the first electrical connector 210.

The interconnect module 202 can further include a second plurality ofelectrically conductive members that can be configured as secondelectrical lands 231 that are carried by the interconnect substrate 226.For instance, the second electrical lands 231 can be spaced from thelands 229 in the rearward direction. Thus, the first lands 229 can bereferred to as front lands, and the second lands 231 can be referred toas rear lands. The electrical lands 231 can be supported by the bottomsurface 227 b of the interconnect substrate 226. The electrical lands231 can be to mate with respective ones of the electrical contacts 224of the second electrical connector 212 when the interconnect module 202is mated with the second electrical connector 212. The first and secondlands 229 and 231 can mate with the respective first and secondelectrical connectors 210 and 212 substantially simultaneously.Alternatively, the first lands 229 can mate with the first electricalconnector 210 before the second lands 231 mate with the secondelectrical connector 212. Alternatively still, the second lands 231 canmate with the second electrical connector 212 before the first lands 229mate with the first electrical connector 210.

While the interconnect module 202 can include the first and secondelectrical lands 229 and 231 supported by the interconnect substrate 226as described above, it should be appreciated that the interconnectsubstrate 226 can support any number of lands as desired in addition tothe first and second lands. For instance, the interconnect substrate 226can support a third plurality of lands. The third plurality of lands canbe disposed between the first and second pluralities of lands 229 or 231with respect to the longitudinal direction. Alternatively, the thirdplurality of lands can be disposed at any suitable alternative locationas desired. The third plurality of lands can be configured to mate withrespective ones of third electrical contacts of the host module 206. Thethird electrical contacts of the host module 206 can be supported by athird electrically insulative housing that can be separate from one orboth of the first and second connector housings 216 and 222,respectively. Alternatively, the third electrically insulative housingcan be monolithic with one or both of the first and second connectorhousings 216 and 222, respectively, as desired. The third plurality oflands can be arranged in at least one row that can be oriented along thelateral direction L. In one example, the third plurality of lands can becarried by the bottom surface 227 b of the interconnect substrate 226.Thus, the interconnect module 202 can include any number of lands thatare configured to be mate with respective ones of any number ofelectrical connectors of the host module 206 having connector housingsthat can be monolithic with each other or separate from each other asdesired.

The interconnect module 202 can include at least one cable 232, such asa plurality of cables 232. In one example, the interconnect module 202can be configured as a transceiver 230 that includes an optical enginethat can be mounted onto the interconnect substrate 226. The cables 232can thus include optical cables that are configured to carry opticalsignals. The optical engine of the transceiver 230 can be configured toreceive optical signals, convert the optical signals to electricalsignals, and output the electrical signals to the at least oneelectrical connector of the host module 206. Further, the optical enginecan be configured to receive electrical signals, convert the electricalsignals to optical signals, and transmit the optical signals along thecables 232. The interconnect substrate 226 can include an IC chip thatis configured to route and/or modify the electrical signals transmittedto and from the transceiver 230, including conditioning or reshaping theelectrical signals for protocol specific data transfers. In alternativeembodiments, the interconnect module 202 may be a transmitter orreceiver instead of a transceiver. In the case of a transmitter, theoptical engine receives electrical signals and transmits them as opticalsignals along the cable 232. In the case of a receiver, the opticalengine receives optical signals and transmits them to the host module206 as electrical signals.

As described above, the interconnect module 202 is configured to matewith both the first electrical connector 210 and the second electricalconnector 212. During operation, optical signals received by thetransceiver from the cables 232 are converted to electrical signals.Ones of the electrical signals are routed to the first electricalconnector 210, while others of the electrical signals are routed to thesecond electrical connector 212. For instance, high speed electricalsignals can be routed to the first electrical connector 210, and lowspeed electrical signals can be routed to the second electricalconnector 212. In one example, the first electrical connector 210 can beconfigured to transmit electrical signals at data transfer speeds of atleast 10 Gigabits per second. Electrical power can also be routed to thesecond electrical connector 212. Conversely, the interconnect module 202can receive electrical signals from one or both of the first and secondelectrical connectors 210 and 212, convert the electrical signals intooptical signals, and output the optical signals to the optical cables232.

In one example, the cables 232 can be configured as electricallyconductive cables that are configured to carry electrical signals. Thus,the interconnect module 202 can be configured to receive electricalsignals from the cables 232, route ones of the electrical signals to thefirst electrical connector 210, and others of the electrical signals tothe second electrical connector 212. Of course, if the cable 116includes only electrical cables, the transceiver can be provided withoutthe optical engine. It should thus be appreciated that the interconnectmodule 202 can also be referred to in some embodiments as a electricalinput/output (I/O) module. Thus, the interconnect module 202 can bereferred to as a data communications module, which can be configured asa transceiver or an I/O module.

With continuing reference to FIGS. 5A-5B, the interconnect module 202further includes a module housing 234 that can house the optical engineand the IC chip. The module housing 234 can be electrically conductive.The module housing 234 can support the interconnect substrate 226. Thetop surface 227 a can face the module housing 234, and the bottomsurface 227 b can face away from the module housing 234. The cables 232can extend out a rear surface of the module housing 234. In exampleswhereby the interconnect module 202 is configured as the transceiver230, the module housing 234 can be a metallic housing. The metallicmodule housing 234 can provide electrical shielding for the opticalengine. Alternatively or additionally, the module housing 234 cantransfer heat away from the optical engine. Further, as illustrated inFIGS. 3A-3B, the interconnect module 202 can include a heat sink 238that is configured to be placed in thermal communication with the modulehousing 234. In one example, the heat sink 238 can be placed in thermalcommunication with the module housing 234 and secured to the cage 214.Any suitable fastener 240 can secure the heat sink 238 to the cage 214.In one example, the heat sink 238 extends from the cage 214 in theupward direction.

Referring now to FIGS. 3A-5B generally, during operation, the first end228 a of the interconnect substrate 226 can be configured to be insertedinto the receptacle 220 of the first electrical connector 210 as it isadvanced in the forward direction so as to cause the first electricallands 229 of the interconnect substrate 226 to mate with respective onesof the first plurality of electrical contacts 218 of the firstelectrical connector 210. In particular, the top row of electrical lands229 can mate with the mating regions of the first electrical contacts218 of the top row of the first electrical connector 210. Similarly, thebottom row of electrical lands 229 can made with respective ones of themating regions of the first electrical contacts 218 of the bottom row ofthe first electrical connector 210. Further, the second electrical lands231 can mate with mating regions 225 of the second plurality ofelectrical contacts 224 of the second electrical connector 212.

Referring now to FIGS. 3A-3B and 6A-6B, and as described above, theinterconnect system 200 can include the cage 214. The cage 214 can beconfigured to be mounted to the panel 204 or mounted to the hostsubstrate 208 and aligned with a panel aperture 205, and can further beconfigured to receive the interconnect module 202. The panel 204 candefine a first side 204 a, a second side 204 b opposite the first sidealong the longitudinal direction L, and the aperture 205 that extendsthrough the panel 204 from the first side 204 a to the second side 204b. The first side 204 a can be spaced from the second side 204 b in theforward direction. The aperture 205 can be sized to receive the cage214. Alternatively, the rear end of the cage 214 can terminate withoutpassing through the panel 204. Further, the rear end of the cage 214 canhave a cross-sectional outer dimension substantially equal to that ofthe aperture 205. Thus, it can be said that the cage 214 can besupported relative to the panel 204.

In one example, the cage 214 can define a cage body 242, and a bore 244that extends through the cage body 242. The cage body 242 can define afront end 243 and a rear end 245 opposite the front end 243 along thelongitudinal direction L. The bore 244 can extend from the rear end 245toward the front end in the forward direction. The bore 244 canterminate without extending through the rear end 245. The cage body 242can include first and second side walls 241 that are opposite each otheralong the lateral direction A. The side walls 241 can extend from thefront end 243 to the rear end 245. The cage body 242 can further definea top 250 and a bottom 249 opposite the top 250 along the transversedirection T. The top 250 and bottom 249 can each extend from the frontend 243 to the rear end 245 along the longitudinal direction L, and fromthe first side wall 241 to the second side wall 241 along the lateraldirection A. The cage body 242 can include a top wall 249 that definesthe top 250 of the cage body 242. The cage body 242 can define at leastone aperture 251 that extends through the bottom 249 in the upwarddirection and is in communication with the bore 244. For instance, thecage body 242 can include a bottom wall 253, and the at least oneaperture 251 extends through the bottom wall 253. The at least oneaperture 251 can include a pair of apertures 251 spaced from each otheralong the longitudinal direction L, wherein a first one of the apertures251 is sized to receive the first electrical connector 210, and a secondone of the apertures 251 is configured to receive the second electricalconnector 212. Alternatively, the at least one aperture 251 can be asingle aperture configured to receive both electrical connectors 210 and212. Alternatively still, the bottom 249 can be devoid of the bottomwall 253, such that the bottom 249 defines the single aperture 251 thatextends from the front end 243 to the rear end 245, and from the firstside to the second side.

The bore 244 can be sized to receive the interconnect module 202 as theinterconnect module 202 is inserted through the aperture 205 of thepanel 204. The cage body 242, and further the cage 214, can be metallicor can include any suitable alternative electrically conductivematerial. Thus, the cage 214 can be configured to provide electricalshielding for the interconnect module 202. Alternatively, at least aportion up to an entirety of the cage body 242, and further the cage,214, can be made of any suitable electrically nonconductive material ifdesired. The bore 244 can extend through the cage body 242 along thelongitudinal direction L. The cage 214 can be configured to be mountedto the panel 204, or mounted to the host substrate 208 and aligned withthe aperture 205 of the panel 204. The interconnect module 202 can beinserted into the bore 244 of the cage 214. In one example, theinterconnect module can be inserted into the bore 244 after the cage 214has been mounted to the panel 204. Thus, when the cage 214 is mounted tothe panel 204, the cage body 242 is configured to support theinterconnect module 202 while at least a portion of the interconnectmodule is disposed in the bore 244 of the cage 214.

The cage 214 can be mounted to one or both of the panel 204 and the hostsubstrate 208 as desired, such that the bore 244 of the cage is alignedwith the aperture 205 of the panel 204. For instance, the cage 214 caninclude an attachment member 246 that is configured to attach to thehost module 206. In one example, the attachment member 246 can beconfigured as at least one clip 247 such as a plurality of clips 247configured to attach to the panel 204. The clip 247 can extend from thecage body 242 and can be configured to receive and capture the panel 204when the cage 214 is inserted into the aperture 205. In one example, thecage 214 is inserted into the aperture 205 in the forward directionuntil the panel 204 is captured in the clip 247. When the cage 214 isattached to the panel 204, the first and second electrical connectorsextend in the upward direction through the bottom 249 of the cage 214.It should be appreciated, however, that the cage 214 can be attached tothe host module 206 in any manner as desired. For instance, theattachment member 246 can be configured as hardware such as screws thatcan secure the cage 214 to the panel 204. Further still, it should beappreciated that the attachment member 246 can secure the cage 214 toany suitable alternative structure of the host module 206. In oneexample, the attachment member 246 can secure the cage 214 to the hostsubstrate 208. For example, the attachment member 246 can include atleast one press-fit pin that fits into a corresponding aperture in thehost substrate 208. The attachment members 246 can provide electricalcontact between the cage body 242 and the panel 204 so as to provideelectromagnetic interference shielding and prevent leakage.

Referring now to FIGS. 3A and 5A-6A the interconnect system 200 caninclude a guidance system 254 that directs the interconnect module 202to mate with the first and second electrical connectors 210 and 212 whenthe interconnect module 202 is mated to the host module 206 through thepanel 204. In particular, the guidance system 254 can guide theinterconnect module 202 to mate with the first electrical connector 210by moving the interconnect module 202 in the forward direction relativeto the panel 204, and thus also relative to the host module 206, untilthe interconnect substrate 226 is mated with each of the first andsecond electrical connectors 210 and 212. It should be appreciated thatthe host module 206 can be maintained at a fixed position with respectto the panel 204 as the interconnect module 202 is inserted through thepanel 204 so as to mate with the host module 206. For instance, the hostsubstrate 208 can be attached to the panel 204.

When the cage 214 and the host substrate 208 are fixed with respect tomovement relative to each other and the panel 204, the interconnectmodule 202 can be inserted into the cage 214. In particular, theinterconnect module 202 is inserted into the cage until the interconnectmodule 202 mates with the first and second electrical connectors 210 and212. In particular, the top and bottom rows of the first plurality oflands 229 mate with the top and bottom rows of the mating regions of theelectrical contacts 218, respectively, of the first electrical connector210. Further, the second plurality of lands mate with the electricalcontacts 224 of the second electrical connector 212. As the interconnectmodule 202 is moved in the forward direction so as to mate with thefirst and second electrical connectors 210 and 212, it is recognizedthat the first plurality of lands 229 move past the second electricalconnector 212. In particular, the first plurality of lands 229 movesfrom a first position whereby the lands 229 are spaced from the matingregions 225 of the second electrical contacts 224 in the rearwarddirection to a second position whereby the lands 229 are spaced from themating regions 225 of the second electrical contacts 224 in the forwarddirection. In one example, the interconnect module 204 can be guidedsuch that the lands 229 of the bottom row of lands 229 are preventedfrom wiping against the second electrical contacts 224 as they move pastthe mating regions 225 in the forward direction. In particular, thelands 229 of the bottom row of lands 229 can be prevented from wipingagainst the mating regions 225 as they move past the mating regions 225in the forward direction.

In one example, the guidance system 254 can guide the interconnectmodule 202 to mate with the first and second electrical connectors 210and 212 while preventing the first lands 229 from wiping against thesecond electrical contacts 224 as they move past the second electricalcontacts 224 in the forward direction. In particular, the first lands229 are spaced from the second electrical contacts 224 so as to define agap therebetween as they move past the second electrical contacts 224 inthe forward direction. In one example, the first lands 229 that arecarried by the bottom surface 227 b of the interconnect substrate 226are spaced from the second electrical contacts 224 along the transversedirection T so as to define a gap therebetween as they move past thesecond electrical contacts 224 in the forward direction. Thus, the gapcan extend along the transverse direction. In one particular example,the first lands 229 that are carried by the bottom surface 227 b of theinterconnect substrate 226 are spaced from the second electricalcontacts 224 in the upward direction as they move past the secondelectrical contacts 224 in the forward direction. Once the interconnectmodule 202 has been moved to a position whereby the lands 229 aredisposed forward of at least the mating regions 225 of the secondelectrical contacts 224, the guidance system 254 can cause theinterconnect module 202 to move in the downward direction toward thehost substrate 208. Thus, when the interconnect module 202 mates withthe first electrical connector 210, the second plurality of lands 231contact respective ones of the mating regions 225 of the secondelectrical contacts 224. Otherwise stated, the guidance system 254 cancause the interconnect module 202 to move in the downward directionuntil the second plurality of lands 231 are substantially coplanar withthe mating regions 225 of the second electrical contacts 224 along aplane that includes the longitudinal direction L and the lateraldirection A. In one example, the second plurality of lands 231 can bealigned with the mating regions 225 along the longitudinal direction L.

The guidance system 254 can include a first guide member 256 that iscarried by interconnect module 202 and a second guide member 258 that iscarried by the cage 214. The first and second guide members 256 and 258are configured to engage each other so as to guide the interconnectmodule 202 to mate with the first and second electrical connectors 210and 212 in the manner described above. In one example, the first andsecond guide members 256 and 258 can engage each other so as to causethe interconnect substrate 226 to move along the transverse direction Tas it moves in the forward direction so as to mate with the first andsecond electrical connectors 210 and 212. For instance, the first andsecond guide members 256 and 258 can engage each other so as to maintainthe first lands 229 that are carried by the bottom surface 227 b of theinterconnect substrate 226 spaced from the second electrical contacts224 as the first lands 229 move past the second electrical contacts 224in the manner described above.

The first guide member 256 can be carried by the module housing 234. Forinstance, the first guide member 256 can be carried by anoutwardly-facing surface of the module housing 234. In one example, thefirst guide member 256 can be carried by a side wall of the modulehousing 234 that is opposite a second side wall of the module housing234 along the lateral direction A. For example, the first guide member256 can be carried by each of the first and second side walls of themodule housing 234. The first guide member 256 can be configured as atleast one recess 260, which can also be referred to as a guide recess.Thus, the at least one recess 260 can extend into the module housing234. For instance, the at least one recess 260 can extend into themodule housing 234 along the lateral direction A. In one example, the atleast one recess 260 can extend into a corresponding at least one of theside walls of the module housing 234. For instance, a recess 260 canextend into both side walls of the module housing 234.

The second guide member 258 can be carried by the cage 214. Forinstance, the second guide member 258 can be carried by aninwardly-facing surface of the cage 214. In one example, the secondguide member 258 can be carried by one of the first and second sidewalls 241 of the cage 214. For example, the second guide member 258 canbe carried by each of the first and second side walls 241 of the cage214. The second guide member 258 can be configured as at least oneprojection 262, which can also be referred to as a guide projection.Thus, the at least one projection 262 can extend out from acorresponding at least one of the side walls 241 toward the other one ofthe side walls 241. Thus, the at least one projection 262 can extendinto the bore 244 of the cage 214.

The at least one projection 262 is configured to be received in the atleast one recess 260 so as to define the guidance system 254 that guidesthe interconnect module 202 to mate with the first and second electricalconnectors 210 and 212. In particular, referring now to FIGS. 7A-7F, theat least one recess 260 can include a first length 260 a and a secondlength 260 b. At least a portion of the first and second lengths 260 aand 260 b are spaced from each other along the longitudinal direction L.For instance, at least a portion of the first length 260 a can be spacedfrom at least a portion of the second length 260 b in the forwarddirection. In one example, an entirety of the first length 260 a can bespaced from an entirety of the second length 260 b in the forwarddirection. Further, at least a portion of the first length 260 a can beoffset from at least a portion of the second length 260 b along thetransverse direction T. For instance, an entirety of the first length260 a can be offset from an entirety of the second length 260 b alongthe transverse direction T. In one example, the at least a portion ofthe first length 260 a can be offset from the at least a portion of thesecond length 260 b in the downward direction. Thus, the entirety of thefirst length 260 a can be offset from the entirety of the second length260 b in the downward direction.

The recess 260 can further include a jog 260 c that is connected betweenthe first length 260 a and the second length 260 b. For instance, thejog 260 c can extend from the first length 260 a to the second length260 b. In one example, the jog 260 c defines a first portion thatextends from the first length 260 a and a second portion that extendsfrom the second length 260 b. At least a portion of the jog 260 c up toan entirety of the jog 260 c can extend along the upward direction as itextends from the first length 260 a to the second length 260 b. Thefirst portion of the jog 260 c can be offset with respect to the secondportion of the jog 260 c in the downward direction. In one example, thefirst and second portions of the jog 260 c can be aligned with eachother along the transverse direction T. Alternatively, the first andsecond portions of the jog 260 c can be offset from each other along thelongitudinal direction. For instance, the first portion of the jog 260 ccan be offset with respect to the second portion of the jog 260 c in theforward direction. The jog 260 c can extend along a curved directionbetween the first and second lengths 260 a and 260 b. Thus, the jog 260c can provide a smooth transition between first length 260 a and secondlength 260 b. This promotes the ability for the projection 262 to travelthrough the jog 260 c while the interconnect module 206 is beinginserted or removed from the cage.

The first length 260 a can define a first leading end and a firsttrailing end that is offset from the first leading end in the rearwarddirection. The first leading end can define a leading end of the recess260. The second length 260 b can similarly define a second leading endand a second trailing end that is offset from the second leading end inthe rearward direction. The second trailing end can define a trailingend of the recess 260. The first leading end of the first length 260 acan be offset with respect to the second trailing end of the secondlength 260 b in the downward direction. It is appreciated that thedownward direction can extend toward the host substrate 208, and theupward direction can extend away from the host substrate 208. The jog260 c can extend from the first trailing end to the second leading end.For instance, the first portion of the jog 260 c can extend from thefirst trailing end, and the second portion of the jog 260 c can extendfrom the second leading end. Thus, it will be appreciated that at leasta portion up to an entirety of the jog 260 c can be orientedperpendicular to one or both of the first and second lengths 260 a and260 b, respectively. Alternatively or additionally, at least a portionup to an entirety of the jog 260 c can be oriented obliquely withrespect to one or both of the first and second lengths 260 a and 260 b,respectively. In one example, one or both of the first and secondportions of the jog 260 c can define respective ends of the jog 260 c.Alternatively, one or both of the first and second portions of the jog260 c can be inwardly spaced from respective ends of the jog 260 c.

At least a portion up to an entirety of the first and second lengths 260a and 260 b can be oriented parallel to each other. For instance, thefirst leading end and the first trailing end of the first length 260 acan be aligned with each other along the longitudinal direction L.Further, the second leading end and the second trailing end of thesecond length 260 b can be aligned with each other along thelongitudinal direction L. Alternatively, at least a respective portionup to a respective entirety of at least one or both of the first andsecond lengths 260 a and 260 b can be oriented oblique to thelongitudinal direction L. It is recognized that the first and secondlengths 260 a and 260 b can be inline and continuous with each other,and thus the recess 260 does not include the jog 260 c in some examples.

Operation of the guidance system 254 will now be described with respectto FIGS. 7A-7F. As illustrated in FIG. 7A, the interconnect module 202is positioned such that the first leading end of the first length 260 ais aligned with the projections 262. Next, as illustrated in FIG. 7B,the interconnect module 202 can be inserted into the bore 244 of thecage 214 in the forward direction. The first leading end of the firstlength 260 a can receive the projection 262 as the interconnect module202 is moved in the forward direction inside the bore 244, and thus withrespect to the host module 206. The projection 262 can be elongate alonga direction that shares a common direction with a direction oforientation of one or both of the first and second lengths 260 a and 260b. Thus, the projection 262 can be geometrically configured to preventthe interconnect module 202 from rotating about the projection 262. Oncethe projection 262 has been received in the first length 260 a at thefirst leading end, the first lands 229 are spaced from the matingregions 225 in the rearward direction. For instance, the first lands 229are spaced from the second electrical connector 212 in the rearwarddirection.

Next, referring to FIG. 7C, the interconnect module 202 is furtherinserted in the forward direction, which causes the projection 262 toslide along the first length 260 a of the recess 260 toward the firsttrailing end. In this example, when the projection 262 is disposed inthe first length 260 a, the projection 262 engages the interconnectmodule 202 in the recess 260 so as to maintain the bottom row of thefirst lands 229 of the interconnect substrate 226 (see FIG. 3B) offsetfrom the mating regions 225 of the second electrical contacts 224 in theupward direction. Thus, it will be recognized that the top row of firstlands 229 is also offset from the mating regions 225 of the secondelectrical contacts 224 in the upward direction. As illustrated in FIG.7D, the interconnect module 202 can be further inserted in the forwarddirection, which causes the projection 262 to slide along the firstlength 260 a of the recess 260 further toward the first trailing end. Inparticular, the interconnect module 202 can be inserted in the forwarddirection until the first lands 229 are spaced from the mating regions225 in the forward direction.

The interconnect module 202 can be inserted in the forward directionuntil the projection 262 is aligned with the jog 260 c. In this positionof alignment with the jog 260 c, the projection 262 can be disposed atthe first trailing end such that interference between the projection 262and the interconnect module 202, and in particular the module housing234, prevents further movement of the interconnect module 202 in theforward direction. Movement of the interconnect module 202 in theforward direction such that the projection 262 moves from the firstleading end of the first length 260 a to the first trailing end can bereferred to as a first stroke of movement in the forward direction. Whenthe projection 262 is aligned with the jog 260 c, the first lands 229can be spaced from the mating regions 225 in the forward direction.

Referring now to FIG. 7E, the interconnect module 202 can be moved inthe downward direction which causes the projection 262 to move in thejog 260 c in the upward direction. The interconnect module 202 can bemoved in the downward direction until the projection 262 is aligned withthe second leading end of the second length 260 b. In particular, theprojection 262 travels through the jog to a position that is alignedwith the second leading end of the second length 260 b along thelongitudinal direction L. Thus, downward forces can cause theinterconnect module 202 to move in the downward direction as theprojection 262 rides in the jog 260 c. When the projection 262 isaligned with the second leading end of the second length 260 b, theinterconnect substrate 226 can be aligned for mating with the firstelectrical connector 210. In particular, the front end 228 a of theinterconnect substrate 226 can be aligned with the receptacle 220 (seeFIG. 4) of the first electrical connector 210. Further, the second lands231 can be aligned to be mated with the mating regions 225 of the secondelectrical contacts 224 of the second electrical connector 212.

Thus, referring now to FIG. 7F, the interconnect module 202 can be movedfurther in the forward direction inside the bore 244 of the cage 214during a second stroke of movement in the forward direction. As theinterconnect module 202 is moved in the forward direction in the secondstroke, the projection 262 travels from the second leading end towardthe second trailing end. The interconnect module 202 can be moved in theforward direction during the second stroke until the interconnect module202 mates with the first and second electrical connectors 210 and 212.In this regard, it should be appreciated that the bottom row of firstelectrical contacts 218 can be substantially coplanar with the matingregions 225 of the second electrical contacts 224 along a plane that isdefined by the longitudinal direction L and the lateral direction A. Theforward movement of the interconnect module 202 can cause the lands 231to wipe against the mating regions 225 as they mate with the matingregions 225. The forward movement of the interconnect module 202 canfurther cause the lands 229 to wipe against the mating regions of thefirst electrical contacts 118 as the lands 229 mate with the firstelectrical contacts 118. It should be appreciated that when theprojection 262 is disposed in the first length 260 a of the recess 260and in the second length 260 b of the recess 260, mechanicalinterference between the projection 262 and the host module 202 canprevent the host module 202 from traveling in the downward directionwith respect to the host module 206. For instance, when the modulehousing 234 defines the recess 260, the mechanical interference can bedefined between the projection and the module housing 234. When the heatsink 238 (see FIGS. 5A-5B) is attached to the cage 214 and contacts theinterconnect module 202 as described above, the weight of the heat sinkcan provide a downward force onto the module housing 234 that biases theinterconnect module 202 in the downward direction as the projectiontravels along the jog 260 c.

Because the front end 228 a of the interconnect substrate 226 isreceived in the receptacle 220 of the first electrical connector 210,interference between the interconnect substrate 226 and the firstconnector housing 216 can prevent further forward motion of theinterconnect module 202 in the bore 244 of the cage 214. Thus, theprojection 262 can be spaced from the second trailing end of the secondlength 260 b in the forward direction. Alternatively, the projection 262can be disposed at the second trailing end when the interconnect module202 is mated with the first and second electrical connectors 210 and212. Thus, interference between the projection 262 and the interconnectmodule 202, and in particular the module housing 234, can alternativelyor additionally prevent further movement of the interconnect module 202in the forward direction with respect to the host module 206 after theinterconnect module 202 has mated with the first and second electricalconnectors 210 and 212. As the interconnect module 202 is mated to thehost module 206 during the first and second strokes, the projection 262can engage the interconnect module 202 in the first and second lengths260 a and 260 b, respectively, so as to maintain the interconnectsubstrate 226 in an orientation along a plane that is defined by thelongitudinal direction L and the lateral direction A.

When it is desired to unmate the interconnect module 202 from the hostmodule 206, the interconnect module is moved in the rearward directionwith respect to the host module 206 until the projection 262 travelsalong the second length 260 b to the jog 260 c, whereby the interconnectmodule 202 is unmated from the host module 206. When the projection 262is disposed in the jog 260 c, the interconnect module 202 can be movedin the upward direction with respect to the host module 206 until theprojection 262 is aligned with the first length 260 a. Movement of theinterconnect module 202 offsets the bottom row of the lands 229 withrespect to the mating regions 225 in the upward direction. Next,movement of the interconnect module 202 in the rearward direction causesthe projection 262 to ride out of the first leading end of the firstlength 260 a. The interconnect module 202 can then be removed from thecage 214. As the interconnect module 202 is removed from the cage 214,the bottom row of lands 229 travels past the mating regions 225 in therearward direction at a location offset from the mating regions 225along the transverse direction T. Thus, the bottom row of lands 229 areprevented from wiping against the mating regions 225. The interconnectmodule 202 can include a pull tab 266 that is configured to receive aforce in the rearward direction that causes the interconnect module 202to unmate from the first and second electrical connectors 210 and 212.The pull tab 266 can extend from the module housing 234 in the rearwarddirection in one example. Further, the pull tab 266 can be coupled to alatch that secures the interconnect module 202 to the host module 206when the interconnect module 202 is mated to the host module 206. Inparticular, the latch can secure the interconnect module 202 to the cage214. When a force is applied to the pull tab 266 in the rearwarddirection, the pull tab can cause the latch to become disengaged fromthe host module 206. Continued applied force to the pull tab 266 in therearward direction cause the interconnect module 202 to unmate from thehost module 206.

It should be appreciated that the recess 260 can include more than onejog 260 c or as many jogs 260 c as desired, such as at least one jog.Thus, the recess 260 can include any number of lengths greater than thefirst length 260 a and the second length 260 b as desired. Each of thelengths can receive the projection 262 which guides the interconnectmodule 202 to move in the forward direction, and each of the jogs can beconnected between respective ones of a pair of the lengths. Further,while the jog 260 c can extend along the transverse direction from thefirst length 260 a to the second length 260 b, it should be appreciatedthat the jog 260 c can be alternatively configured in any manner asdesired. In one example, the jog 260 c can be oriented along a directionthat is oblique to the longitudinal direction L. For instance, the jog260 c can extend in the upward direction as it extends in the rearwarddirection from the first length 260 a to the second length 260 b.

It will be appreciated that the recess 260 can be said to define a trackthat engages the host module 206 so as to cause the interconnect module202 to move along the first stroke of forward movement, then along thedownward direction, then along the second stroke of forward movement. Ifthe interconnect module 202 includes the third row of lands describedabove, the third row of lands can also remain spaced above the matingregions 225 as it moves past the mating regions 225 in the forwarddirection before mating with its respective electrical connector on thehost module 206.

As described above, the first guide member 256 can be configured as theat least one recess 260, and the second guide member 258 can beconfigured as the at least one projection 262. It should be appreciatedthat the at least one recess 260 can include first and second recessesthat extends into the first and second side walls, respectively, of themodule housing 234. Further, the at least one projection 262 can includefirst and second projections 262 that extend out from the first andsecond side walls 241, respectively, of the cage 214.

Further still, while the first guide member 256 is configured as the atleast one recess 260 and the second guide member 258 is configured as atleast one projection in one example, it should be appreciated that thefirst guide member 256 can alternatively be configured as the at leastone projection 262, and the second guide member 258 can alternatively beconfigured as the at least one recess 260. In this example, the recesswould include the first and second lengths 260 a and 260 b, and thetransverse jog 260 c that is connected between the first and secondlengths 260 a and 260 b in the manner described above. The first length260 a would be further again be spaced from the second length 260 b inthe forward direction. The second length 260 b would define the leadinglength, such that the at least one projection 262 would be received bythe second length 260 b, travel through the jog 260 c, and travel fromthe jog 260 c to the first length 260 a until the interconnect module202 is mated with the first and second electrical connectors 210 and212. Thus, the first length 260 a would be offset from the second length260 b in the downward direction. The first and second lengths 260 a and260 b can be parallel to each other along the longitudinal direction Las described above. Alternatively, at least one a portion of or both ofthe first and second lengths 260 a and 260 b can extend along adirection oblique to the longitudinal direction L.

Further, the first and second guide members 256 and 258 can both beconfigured as at least one protrusion. For instance, the interconnectmodule 202 can include a projection extend out along the lateraldirection A with respect to each of the opposed sides of the modulehousing 234. The cage 214 can similarly define a complementary shelfthat extend in from each of the sides 241. The projections of theinterconnect module 202 ride along the shelfs of the cage 214 so as tomaintain the first lands 229 spaced above the electrical contacts 224 ofthe second electrical connector 212 in the manner described above. Theprojections of the interconnect module 202 can ride off of the shelfs ofthe cage 214 in the forward direction once the lands 229 have traveledto a position forward of the second electrical connector 212, at whichpoint the interconnect module 202 drops in the downward direction sothat the first lands 229 are aligned to be mated with the firstelectrical connector 210, and the second lands 231 are aligned to bemated with the second electrical connector 212 in the manner describedabove. For instance, the projections of the interconnect module 202 canride off the shelfs and onto respective platforms. The projections canride along the platforms so as to guide the interconnect module 202 tomate with the first and second electrical connectors 210 and 212 in theforward direction as described above. The shelf and platform can contactthe projection of the interconnect module 202 so as to prevent theinterconnect module from movement in the downward direction with respectto the host module 206, but do not prevent the interconnect module 202from movement in the upward direction with respect to the host module206.

Further, while the first guide member 256 can be carried by the modulehousing 234 in one example, it should be appreciated that the firstguide member 256 can be carried by any suitable alternative structure ofthe interconnect module 202. By way of example and not limitation, thefirst guide member 256 can be configured as a projection that extendsout from the interconnect substrate 226. Further, while the second guidemember 258 is carried by the cage 214 in one example, it should beappreciated that the second guide member 258 can be carried by anysuitable alternative structure of the host module 206. For instance, byway of example and not limitation, the second guide member 258 can becarried by the host substrate 208. It should be appreciated that therelative position of the protrusion 262 and first and second lengths 260a and 260 b length recesses can be reversed. That is instead of the cage214 having a protrusion the interconnect module housing 234 may have aprotrusion that engages with a slot in the cage. Also, as describedabove, the first guide member 256 can be configured as at least oneprojection. For instance, the first guide member 256 can be configuredas first and second projections 262 that are offset from each otheralong the longitudinal direction L. Incorporating the first and secondprotrusions 262 can reduce the possibility of inadvertent tilting of theinterconnect module 206 as it is being inserted or removed, which mightresult in electrical contact between the first lands and secondconnector contacts.

As described above, it is contemplated that the recess 260 may notinclude the jog 260 c. In this example, the first length 260 a can beoblique to the longitudinal direction L, such that the first trailingend is offset with respect to the first leading end in the upwarddirection. Further, the first trailing end can be open to the secondleading end. Whether the projection 262 travels through the jog 260 c toa position aligned with the second leading end, or whether theprojection 262 travels to the first trailing end and is thus alignedwith the second leading end, 1) the front end 228 a of the interconnectsubstrate 226 can be aligned with the receptacle 220 (see FIG. 4) of thefirst electrical connector 210, and 2) the second lands 231 can bealigned to be mated with the mating regions 225 of the second electricalcontacts 224 of the second electrical connector 212.

The guidance system 254 has been described in accordance with a firstexample whereby the interconnect module 202 is guided 1) from a firstposition along the transverse direction I whereby the bottom row of thelands 229 is offset in the upward direction with respect to both themating regions 225 and the receptacle 220 2) to a second position alongthe transverse direction T whereby the bottom row of lands 229 is matedwith the bottom row of mating regions of the first electrical contacts218, the top row of lands 229 is mated with the top row of matingregions of the first electrical contacts, and the row of lands 231 ismated with the mating regions 225 of the second electrical contacts 224.In this first example, the interconnect module 202 is guided to movealong the transverse direction T, and in particular in the downwarddirection, as it moves in the forward direction. In particular, theinterconnect module 202 can be guided to move along the transversedirection T, and in particular in the downward direction, as it movesfrom a first stroke to a second stroke in the forward direction.

Referring now to FIGS. 8A-8B, the guidance system 254 (described above)can be configured to cause the mating regions 225 to move along thetransverse direction T. In particular, the guidance system 254 can beconfigured to cause the mating regions 225 to move in the upwarddirection with respect to each of the mating regions of the firstelectrical contacts 218 of the first electrical connector 210 and theinterconnect module 202. In a first or initial position, the matingregions 225 of the second electrical contacts 224 can be offset withrespect to the bottom row of mating regions of the first electricalcontacts 218 of the first electrical connector 210 in the downwarddirection. The mating regions 225 can be disposed in the first orinitial position as the bottom row of lands 229 move from a firstposition whereby the bottom row of lands 229 is offset with respect tothe mating regions 225 in the rearward direction to a second positionwhereby the bottom row of lands 229 is offset with respect to the matingregions 225 in the forward direction.

When the mating regions 225 are in the first or initial position, themating regions 225 can also be offset with respect to the row of secondplurality of lands 231 in the downward direction. Thus, once the bottomrow of the first plurality of lands 229 is offset with respect to themating regions 225 in the forward direction, the guidance system 254 canurge the mating regions 225 to move in the upward direction to a secondposition whereby the mating regions 225 are aligned with respective onesof the second plurality of lands 231 along the longitudinal direction.In particular, the guidance system 254 can urge the mating regions 225to move to the second position when the mating regions 225 are disposedbetween the first lands 229 and the second lands 231 with respect to thelongitudinal direction. In one example, the guidance system 254 can urgea portion of the second connector housing 222 to move in the upwarddirection so as to cause the mating regions 225 to similarly move in theupward direction.

In particular, the guidance system 254 can include the recess 260 andthe projection 262 in the manner described above. In this example,however, the recess 260 can receive the projection 262 so as to guidethe interconnect module 202 to move in the forward direction. The recess260 can be oriented along the longitudinal direction L. The interconnectmodule 202 can include a biasing member 264 that is configured to engagewith the second electrical connector 212 so as to urge the creatingregions 225 to move in the upward direction with respect to the hostsubstrate 208 and the lands 229 and 231 from the first or initialposition to the second position. In one example, the biasing member 264can cause a portion of the connector housing 222 to move in the upwarddirection, which in turn causes the mating regions 225 to move in theupward direction with respect to the host substrate 208 and the lands229 and 231 from the first or initial position to the second position.In particular, the second connector housing 222 can define a firstportion 222 a that defines the mounting end 213 b of the secondelectrical connector 212, and a second portion 222 b that supports themating regions 225 of the second electrical contacts 224. The secondportion 222 b can be movable with respect to the first portion 222 a. Inone example, the second portion 222 b can be pivotally coupled to thefirst portion 222 a. Alternatively, the biasing member 264 canalternatively engage the second electrical contacts 224 so as to urgethe mating regions 225 to move from the first or initial position to thesecond position. Whether the biasing member 264 engages the connectorhousing 222, the electrical contacts 224, or some other engagementstructure that causes the mating regions 225 to move in the upwarddirection, it can be said that the biasing member 264 biases the matingregions 225 in the upward direction to the second position.

During operation, the interconnect module 202 is positioned such thatthe leading end of the recess 260 is aligned with the projections 262.Next, the interconnect module 202 can be inserted into the bore 244 ofthe cage 214 in the forward direction. The leading end of the recess 260can receive the projection 262 as the interconnect module 202 is movedin the forward direction inside the bore 244, and thus with respect tothe host module 206. As the interconnect module 202 is further moved inthe forward direction, the projection 262 engages the interconnectmodule 202 in the recess 260 so as to guide the interconnect module 202to mate with the first electrical connector 210 in the manner describedabove. In one example, the recess 260 can be oriented in thelongitudinal direction L, and the interconnect module 202 can thus bealigned for mating with the first electrical connector 210 when theprojection 262 is received in the recess 260. As described above,movement of the interconnect module 202 in the forward direction withrespect to the host module 206 causes the projection 262 to traveltoward the trailing end of the recess 260. It should be appreciated thatthe recess 260 can have any suitable geometry and orientation as desiredsuch that the projection 262 guides the interconnect module 202 in therecess 260 to mate with the first electrical connector 210. Further, itshould be appreciated that when the projection 262 is disposed in therecess 260, mechanical interference between the projection 262 and thehost module 202 can prevent the host module 202 from traveling in thedownward direction with respect to the host module 206. For instance,when the module housing 234 defines the recess 260, the mechanicalinterference can be defined between the projection and the modulehousing 234.

When the projection 262 is received in the recess 260 and disposed atthe leading end of the recess 260, the lands 231 are offset with respectto the mating regions 225 in the upward direction. The interconnectmodule 202 moves in the forward direction with respect to the hostmodule 206 until the biasing member 264 engages the second electricalconnector 212. Further movement of the interconnect module 202 relativeto the host module 206 causes the biasing member 264 to bias the matingregions 225 in the upward direction to the second position in the mannerdescribed above. In one example, the basing member 264 can bewedge-shaped. Alternatively or additionally, the complementaryengagement member of the second electrical connector 212 that engagesthe biasing member 264 can be wedge shaped. When the mating regions 225are in the second position, the mating regions 225 are aligned withrespective ones of the lands 231. Thus, it can be said that the guidancesystem 254 can include the biasing member 264. The biasing member 264can be positioned such that movement of the mating regions 225 in theupward direction occurs when the mating regions 225 are aligned with thelands 231 along the transverse direction T. Alternatively, the biasingmember 264 can be positioned such that movement of the mating regions225 in the upward direction occurs when the lands 231 are offset withrespect to the mating regions 225 in the rearward direction. Thus,forward movement of the interconnect module 202 with respect to the hostmodule 206 causes the lands 231 to mate with respective ones of themating regions 225. The forward movement of the interconnect module 202can cause the lands 231 to wipe against the mating regions 225 as theymate with the mating regions 225. The forward movement of theinterconnect module 202 can further cause the lands 229 to wipe againstthe mating regions of the first electrical contacts 118 as the lands 229mate with the first electrical contacts 118.

Because the front end 228 a of the interconnect substrate 226 isreceived in the receptacle 220 of the first electrical connector 210,interference between the interconnect substrate 226 and the firstconnector housing 216 can prevent further forward motion of theinterconnect module 202 in the bore 244 of the cage 214. Thus, theprojection 262 can be spaced from the second trailing end of the recess260 in the forward direction. Alternatively, the projection 262 can bedisposed at the trailing end of the recess 260 when the interconnectmodule 202 is mated with the first and second electrical connectors 210and 212. Thus, interference between the projection 262 and theinterconnect module 202, and in particular the module housing 234, canalternatively or additionally prevent further movement of theinterconnect module 202 in the forward direction with respect to thehost module 206 after the interconnect module has mated with the firstand second electrical connectors 210 and 212. As the interconnect module202 is mated to the host module 206, the projection 262 can engage theinterconnect module 202 in the recess 260 so as to maintain theinterconnect substrate 226 in an orientation along a plane that isdefined by the longitudinal direction L and the lateral direction A.

When it is desired to unmate the interconnect module 202 from the hostmodule 206, the interconnect module 202 is moved in the rearwarddirection in the bore 244 of the cage 214 with respect to the hostmodule 206. As the interconnect module 202 is moved in the rearwarddirection, the projection 262 travels in the recess 260 in the forwarddirection, which guides the movement of the interconnect module 202 inthe rearward direction. As the interconnect module 202 moves in therearward direction, the interconnect member 202 unmates from the firstand second electrical connectors 210 and 212. Further, the biasingmember 264 disengages from the second electrical connector 212.Consequently, the mating regions 225 return to the first or initialposition wherein the mating regions 225 are offset with respect to thebottom row of the lands 229 in the downward direction. Further movementof the interconnect module 202 with respect to the host module 206 canremove the interconnect module 202 from the cage 214. As theinterconnect module 202 is removed from the cage 214, the bottom row oflands 229 travels past the mating regions 225 in the rearward directionat a location offset from the mating regions 225 along the transversedirection T. Thus, the bottom row of lands 229 are prevented from wipingagainst the mating regions 225. While the guidance system 265 caninclude the recess 260 and the projection 262 in the manner describedabove, it should be appreciated that the guidance system 265 canalternatively be defined by an inner surface of the cage body 242 thatat least partially defines the bore 244, and an outer surface of themodule housing 234 that rides along the inner surface of the cage body242. Thus, the inner perimeter of the cage body 242 can define the firstguidance member 256, and the outer perimeter of the module housing 234can define the second guidance member 258.

Referring to FIGS. 9A-9B, the guidance system 254 can be constructed inaccordance with yet another example. As described above with respect toFIGS. 8A-8B, the mating regions 225 can be disposed at first or initialposition, the mating regions 225 of the second electrical contacts 224can be offset with respect to the bottom row of mating regions of thefirst electrical contacts 218 of the first electrical connector 210 inthe downward direction. Further, the bottom row of the first lands 229can extend down from the interconnect substrate 226 to a first location,and the row of the second lands 231 can extend down from theinterconnect substrate 226 to a second location that is offset in thedownward direction with respect to the first location. The downwarddirection as applied to the bottom row of the first lands 229 and thesecond lands 231 can be away from the interconnect substrate 226.

When the projection 262 is received in the recess 260, the first end 228a of the interconnect substrate 226 can be aligned for mating with thefirst electrical connector 210 along the longitudinal direction L.Otherwise stated, the top row of the first lands 229 can be coplanarwith the top row of the mating regions of the first electrical contacts218 with along a respective plane that includes the longitudinaldirection L and the lateral direction A. For instance, the top row ofthe first lands 229 can be aligned with respective ones of the top rowof the mating regions of the first electrical contacts 218 along thelongitudinal direction L. Further, the bottom row of the first lands 229can be coplanar with the bottom row of the mating regions of the firstelectrical contacts 218 with along a respective plane that includes thelongitudinal direction L and the lateral direction A. For instance, thebottom row of the first lands 229 can be aligned with respective ones ofthe bottom row of mating regions of the first electrical contacts 218along the longitudinal direction L. Thus, the bottom row of the firstlands 229 can be offset with respect to the mating regions 225 of thesecond electrical contacts 224 of the second electrical connector 212 inthe upward direction. Further still, the second lands 231 can besubstantially coplanar with the mating regions 225 of the secondelectrical contacts 224 with along a respective plane that includes thelongitudinal direction L and the lateral direction A. For instance, thesecond lands 231 can be substantially aligned with respective ones ofthe mating regions 225 of the second electrical contacts 224 along thelongitudinal direction L. Thus, movement of the interconnect substrate226 in the forward direction will cause the second lands 231 to matewith the respective ones of the mating regions 225.

Thus, it should be appreciated that the bottom row of first lands 229extends from the interconnect substrate 226 a first distance in thedownward direction, and the second lands 231 extend from theinterconnect substrate 226 a second distance in the downward directionthat is greater than the first distance. Further, the second lands 231can include a spring member that has a spring constant as the springmember compresses in the upward direction toward the interconnectsubstrate 226.

Thus, when the projection 262 is received in the recess 260, theinterconnect module 202 is guided to move in the forward direction inthe bore 244 of the cage 214 in the manner described above. As a result,the bottom row of the first lands 229 move past the mating regions 225of the second electrical contacts 224 without wiping against the matingregions 225. For instance, the bottom row of the first lands 229 can bespaced from the mating regions 225 so as to define a gap therebetween.The gap can extend along the transverse direction T. During operation,the interconnect module 202 can be guided by the projection 262 to movein the forward direction with respect to the host module 206 until theinterconnect module 202 mates with the first and second electricalconnectors 210 and 212 in the manner described above. The forwardmovement of the interconnect module 202 can cause the lands 231 to wipeagainst the mating regions 225 as they mate with the mating regions 225.Further, in all examples described above, the top row of the first lands229 can wipe against the top row of the first electrical contacts 218 asthey mate with the top row of the first electrical contacts 218.Similarly, the bottom row of the first lands 229 can wipe against thebottom row of the first electrical contacts 218 as they mate with thebottom row of the first electrical contacts 218. As the interconnectmodule 202 is mated to the host module 206, the projection 262 canengage the interconnect module 202 in the recess 260 so as to maintainthe interconnect substrate 226 in an orientation along a plane that isdefined by the longitudinal direction L and the lateral direction A.

When it is desired to unmate the interconnect module 202 from the hostmodule 206, the interconnect module 202 is moved in the rearwarddirection in the bore 244 of the cage 214 with respect to the hostmodule 206. As the interconnect module 202 is moved in the rearwarddirection, the projection 262 travels in the recess 260 in the forwarddirection, which guides the movement of the interconnect module 202 inthe rearward direction. As the interconnect module 202 moves in therearward direction, the interconnect member 202 unmates from the firstand second electrical connectors 210 and 212. Further, the bottom row ofthe first lands 229 remain offset with respect to the mating regions 225in the upward direction. The interconnect module 202 can move in therearward direction with respect to the host module 206 as theinterconnect module 202 is removed from the cage 214. As theinterconnect module 202 is removed from the cage 214, the bottom row oflands 229 travels past the mating regions 225 in the rearward directionat a location offset from the mating regions 225 along the transversedirection T. Thus, the bottom row of lands 229 are prevented from wipingagainst the mating regions 225. Referring to FIGS. 8A-9B, in oneexample, an entirety of the recess 260 that receives the protrusion 262during mating of the interconnect module 202 to the host module 206 canbe oriented along the longitudinal direction L. While the guidancesystem 265 can include the recess 260 and the projection 262 in themanner described above, it should be appreciated that the guidancesystem 265 can alternatively be defined by an inner surface of the cagebody 242 that at least partially defines the bore 244, and an outersurface of the module housing 234 that rides along the inner surface ofthe cage body 242. Thus, the inner perimeter of the cage body 242 candefine the first guidance member 256, and the outer perimeter of themodule housing 234 can define the second guidance member 258.

Referring to FIGS. 7A-9B generally, it should be appreciated that theguidance system 254 can include the first and second lengths 260 a and260 b in combination with the biasing member 264. Alternatively oradditionally, when the guidance system 254 includes the first and secondlengths 260 a and 260 b, the second lands 231 and the mating regions 225of the second electrical contacts 224 can be offset with respect to thebottom row of the first lands 229 and the bottom row of the matingregions of the first electrical contacts 218, respectively, in thedownward direction. Alternatively or additionally still, the guidancesystem 254 can include the biasing member 264 and the second lands 231and the mating regions 225 of the second electrical contacts 224 can beoffset with respect to the bottom row of the first lands 229 and thebottom row of the mating regions of the first electrical contacts 218,respectively, in the downward direction.

As illustrated in FIGS. 3A-3B, the interconnect system can include anynumber of interconnect modules 202 as desired that are each configuredto be mounted to a common panel or different panels, and mated withrespective first and second electrical connectors. While twointerconnect modules 202 are shown, the interconnect system 200 caninclude any number of interconnect modules 202 as desired. Thus, theinterconnect system 200 can include a plurality of cages 214 configuredto receive individual ones of a respective plurality of the interconnectmodules 202. The cages 214 can be stacked The cages 214 can be separatefrom each other or monolithic with each other as desired. Further, theinterconnect modules 202 can be driven through respective differentapertures of the panel 204, or through a common aperture of the panel204. Further still, the interconnect modules 202 can be driven throughthe same panel 204 or different panels 204. It should also beappreciated that the host modules 206 to which the interconnect modules202 are mated can share a common host substrate 208, or can includeseparate host substrates 208 as desired.

As described above, it is recognized that in some circumstances, it maybe desired to mate and unmate the interconnect module 202 with the hostmodule 206 through the panel 204. For instance, the interconnect module202 can be “hot pluggable” through the panel 204, as described in moredetail below. That is the interconnect module 202 can be mated with thehost module 206 while power is being supplied to the host substrate 208.Because the front lands 229 pass over the second electrical connector212 without making electrical contact with the second electricalcontacts 224 as the interconnect module 202 is mated with the hostmodule 206, the interconnect module 202 can be hot pluggable with thehost module 206. When the host module 206 that is configured to matewith the interconnect module 202 through one or both of the panel 204and the cage 214 can be referred to as a panel-mount host module 206. Itis appreciated that the panel-mount host module 206 can include the cage214 that is supported relative to the panel 204. For instance, the cage214 can be supported at a fixed location relative to the panel 204. Inone example, the cage 214 can be mounted to the panel 204. Alternativelyor additionally, the cage 214 can be mounted to the host substrate 208.The host substrate 208 may in turn be mounted to the panel 204 viabrackets or some other type of mounting hardware.

Referring now to FIG. 10A, the present disclosure recognizes that thehost substrate 208 can define a mid board location 268, and theinterconnect module 202 can be mated to the mid board location 268. Theterm “mid board” can refer to a location where the interconnect module202 is connected to the host substrate 208 not through a panel 204. Insome examples, the mid board location 268 can be inwardly spaced fromthe outer perimeter of the host substrate 208. When the interconnectmodule 202 is mated to the host module 206 through the panel 204 asdescribed above, it can be said that the interconnect module 202 ismated to an edge of the host substrate 208 that faces the panel 204, asdescribed above.

The present disclosure recognizes that when mating interconnect modules202 to a host module 206 through a panel, the number of interconnectmodules 202 that can be mated with a host module can be limited by thedimensions of the panel. Also, when the interconnect module 202 is matedto the host module 206 through the panel 204, the electrical connectionsto the first connector 210 on the host substrate 208 are made proximateto the edge defined by the second end 207 b of the host substrate 208,as described above. Accordingly, there may be long electricaltransmission paths in the host substrate 208 between the first connector210 and any integrated circuits where the high speed signals areprocessed or manipulated. Thus, the present disclosure recognizes thatit can be desirable to allow the interconnect module 202 to makeelectrical connections with the host substrate 208 at locationsunconstrained by the panel 204. Accordingly, it can be advantageous thatthe interconnect module 202 can selectively mate with the host module206 both through the panel 204, and at the mid board location 268 of thehost substrate 208 without passing through any panel. While conventionaltransceivers work well for either panel mount or mid board applications,the present disclosure provides a single transceiver that can be usedinterchangeably in both applications.

Thus, in some circumstances, it may be desired to mate the interconnectmodule 202 with the host module 206 at the mid board location 268 of thehost substrate 208. The host module 206 including the mid board location268 can be referred to as a mid board host module 206. Because theinterconnect modules 202 mated to the host module 204 through the frontpanel 204 are disposed at the second edge of the host substrate 208,each host module 206 can only be mated to singular interconnect modules202 that are arranged along respective rows oriented along the lateraldirection A and spaced from each other along the transverse direction T.When interconnect modules 202 are mated to the host module 204 at themid board location, additional interconnect modules can be mated to thehost module 204 at locations spaced from each other along thelongitudinal direction L, thereby resulting in a larger number ofinterconnect module 202 mated to the host module 204.

Further, the first and second electrical connectors 210 and 212 can bemounted at any suitable location on the mid board as desired, withoutbeing constrained by the position of the panel 204 as in panel mountapplications. Also, transmission distance thru the host substrate 208may be shorter than in panel mount applications, which can improvesignal strength and integrity. When mating the interconnect module 202to the host substrate 208 at the mid board location 268, it can bedesirable to reduce the area of the host substrate 208 that has to bekept clear of components to allow for maximum density of interconnectmodules 202 mated to the host module 204. It can be desirable toapproach the host module 204 with the interconnect module 202 in amostly downward motion while in the case of a front panel interconnectmodule it is desirable to load the module in a mostly forward motionalong the longitudinal direction L. It can also be desirable to have asingle interconnect module 202 that can be used for either mid board orfront panel mating to the host module 204 in order to reduce inventoryand SKU. When mating the interconnect module 202 to the host substrate208 at the mid board location, the interconnect module 202 can mate withthe first and second electrical connectors 210 and 212 as describedabove with respect to the interconnect module 102 and the first andsecond electrical connectors 152 and 154 with reference to FIGS. 1A-1C.Advantageously, the same interconnect module 202 may be usedinterchangeably in either a front panel mount or mid board connection.

As illustrated in FIG. 10A, in mid board applications, the heat sink 238can be attached to the module housing 234. The heat sink 238 can beattached to the module housing 234 before the interconnect module 202 ismated to the host module 206. Alternatively, the heat sink 238 can beattached to the module housing 234 after the interconnect module 202 ismated to the host module 206. Further, the interconnect system 200 caninclude at least one latch 270 that is configured to secure theinterconnect module 202 to the mid board location 268 after theinterconnect module 202 has been mated to the first and secondelectrical connectors 210 and 212 that are mounted at a mid boardlocation 268 of the host substrate 208. It should be appreciated thatthe first electrical connector 210 mounted to the host substrate 208 atthe mid board location 268 can be constructed the same as or differentlythan the first electrical connector 210 that is mated to theinterconnect module 202 in the cage 214 as described above.Alternatively or additionally, the second electrical connector 212mounted to the host substrate 208 at the mid board location 268 can beconstructed the same as or differently than the second electricalconnector 212 that is mated to the interconnect module 202 in the cage214 as described above. While the respective housings of the first andsecond electrical connectors 210 and 212 may be different depending onthe respective mounting locations of the first and second electricalconnectors 210 and 212, the contact locations of the first and secondelectrical connectors 210 and 212 may be substantially identical in bothfront panel and mid board applications so that the same transceiver canmate at both locations.

The latch 270 can be mounted to the host module 206 and secured to theinterconnect module 202 when the interconnect module is mated with thefirst and second electrical connectors 210 and 212 that are mounted tothe host substrate 208 at the mid board location 268. In one example,the latch 270 can be mounted to the host substrate 208 at the mid boardlocation 268. Alternatively, at least one latch 270 can be mounted to arespective at least one or both of the first and second electricalconnectors 210 and 212. It should be appreciated that the at least onelatch can be mounted to any suitable structure of the host module 206 asdesired. Further, the at least one latch 270 can engage the interconnectmodule 202 so as to secure the interconnect module 202 to the hostmodule 206 when the interconnect module is mated to the host module 206.It should be appreciated that the latch used to secure theinterconnection module 202 in a mid board application may be differentthan an attachment member that secures the interconnection module 202 tothe host module 206 in a front panel mount application.

Referring now to FIG. 10B, the interconnect module 202 can include alatch engagement member 272 that is configured to secure theinterconnect module 202 to the latch 270 when the latch is mounted tothe host module 206. The latch 270 can be configured in accordance withany suitable example described in PCT Patent Application Serial No.PCT/US17/46918 filed on Aug. 15, 2017, the disclosure of which is herebyincorporated by reference as if set forth in its entirety herein. In oneexample, the latch engagement member 272 can be configured as at leastone latch channel 274 that is configured to receive the corresponding atleast one latch 270 so as to secure the latch 270 to the interconnectmodule 202. The latch channel 274 can extend into the module housing234. For instance, the latch channel 274 can extend into the modulehousing 234 along the lateral direction A. In one example, the latchchannel 274 can extend into a corresponding at least one of the sidewalls of the module housing 234 in a direction toward the other one ofthe side walls of the module housing 234. For instance, the latchchannel 274 can extend into both of the side walls of the module housing234. The latch channel 274 can further extend into a top wall of themodule housing 234. It should be appreciated, of course, that the latchengagement member 272 can be constructed in accordance with any suitableembodiment as desired.

In certain examples, the interconnect module 202 can include both thefirst guide member 256 and the latch engagement member 272. Thus, theinterconnect module 202 can be configured to be selectively mated withthe host module 206 through the panel 204 as described above, and thehost module 206 wherein the host substrate 208 is configured as the midboard connection 268. In one example, at least a portion of the latchchannel 274 can intersect the recess 260. For instance, the portion ofthe latch channel 274 can be substantially oriented in the transversedirection T. The latch channel 274 can define a width along thelongitudinal direction L that is less than the length of the protrusion262 along the longitudinal direction L. Thus, the protrusion 262 canslide past the latch channel 274 as it travels in the recess 260 alongthe longitudinal direction L

Further still, in some examples, the host module 206 can define both themid board connection 268 and the panel-mount interconnect module 202.Thus, the same host substrate 208 can be used to both mate with a firstinterconnect module 202 at the mid board location 268, and a secondinterconnect module 202 through a panel 204. That is, at least one firstinterconnect module 202 can be mated with the first and secondelectrical connectors 210 and 212 that are mounted to the host substrate208 at the mid board location 268. Further, at least one secondinterconnect module 202 can be mated to the host substrate 202 throughthe panel 204 in the manner described above. Thus, the host substrate208 can include first and second electrical connectors 210 and 212 thatare configured to mate with the first at least one of the interconnectmodules 202 whereby the latch 270 secures the interconnect module 202 tothe host substrate 208. The host substrate 208 can further include firstand second electrical connectors 210 and 212 that extend into aninternal bore of a cage in the manner described above, such that thesecond at least one of the interconnect modules 202 is configured tomate with the first and second electrical connectors 210 and 212 in thecage in the manner described above.

Thus, a method can include the step of receiving at least oneinterconnect module 202, and determining whether to mate the at leastone interconnect module 202 to a first host module 206 having apanel-mount host substrate through the panel 204, or to mate it to asecond host module 206 at a mid board location. The at least oneinterconnect module 202 can be received as a singular interconnectmodule 202 that is configured to be selectively mated to each of thefirst and second host modules 206 without modification to theinterconnect module 202. In particular the first guide member 256 can beconfigured to engage the second guide member 258 as described above.Alternatively, the latch engagement member 272 can engage the latch 270in the manner described above.

Alternatively, the at least one interconnect module 202 can be receivedas first and second interconnect modules 202. If it is decided to matethe interconnect module 202 to the host module 206 through the panel204, the first interconnect module 202 can include the first guidemember 256 so as to be guided to mate with the host module 206 as it isinserted through the panel 204 in the manner described above. If it isdecided to mate the at least one interconnect module 202 to the midboard connection 268, the interconnect module 202 can include the latchengagement member 272 and mated to the mid board connection 268 asdescribed above. The method can further include the step of mating thefirst interconnect module 202 to the host module 206 through the panel204 in the manner described above. The method can further include thestep of mating the second interconnect module 202 to the host module 206at the mid board location 268 in the manner described above. With theexception of the first guide member 256 and the latch engagement member272, the first and second interconnect modules 202 can be constructedsubstantially (e.g., within manufacturing tolerances) identical to eachother. Thus, the first and second interconnect modules 202 can consistessentially of the module housing 234, the interconnect substrate 226,and the cables 232 so as to mate with the host module 206 in the mannerdescribed above.

Alternatively, it should be appreciated that the first interconnectmodule 202 can include the latch engagement member 272. Similarly, thesecond interconnect module 202 can include the first guide member 256.Thus, the first and second ones of the interconnect modules 202 can besubstantially (within manufacturing tolerance) identical to each other.Alternatively still, the at least one interconnect module 202 can be asingle interconnect module 202 that can be mated to the host module 206through the panel 204 in the manner described above, or onto the midboard location 268 in the manner described above.

It is recognized that when the interconnect module 202 is mated to thehost module 206 at the mid board location 268 of the host substrate 208,in order to avoid interference with other components mounted on the hostsubstrate 208, the interconnect module 202 often approaches the hostsubstrate 208 along a direction of mid board approach that is has afirst directional component in the downward direction, and a seconddirectional component in the forward direction. The first directionalcomponent in the downward direction is greater than the seconddirectional component in the forward direction. Immediately after theinterconnect module 202 has approached the host module 206, theinterconnect module 202 is then mated with the host module 206 along aselect direction. The select direction can, for instance, include theforward direction as described above.

When the interconnect module 202 is mated to the host module 206 throughthe panel 204, it is recognized that the interconnect module 202approaches the host module 206 along a direction of panel mount approachthat can include the forward direction only (for instance in examplesthat include the biasing member 264 or when the mating regions 225 ofthe second electrical contacts 224 are offset with respect to the matingregions of the first electrical contacts 218). Alternatively, thedirection of panel mount approach can include a first directionalcomponent in the downward direction and a second directional componentin the forward direction (for instance, when the guidance system 254includes the jog 260 c). In the panel mount approach, the seconddirectional component can be greater than the first directionalcomponent. For instance, in the panel mount approach, the interconnectmodule 202 may move in the forward direction at least 5 times themovement of the interconnect module 202 in the downward direction.Immediately after the interconnect module 202 has approached the hostmodule 206 through the panel 204, the interconnect module 202 is thenmated with the host module 206 along the select direction.

Either way, it is recognized that the direction of mid board approachcan have a directional component in the downward direction that isgreater than the directional component in the downward direction of thedirection of panel mount approach. The directions of mid board approachcan occur over the same select distance as the direction of panel mountapproach. For instance, the select distance can be approximately 20 mmprior to driving the interconnect module 202 in the forward direction soas to mate with the host module 206. Further the direction of mid boardapproach and the direction of panel mount approach can terminate oncethe interconnect substrate 226 is aligned with the mating regions of thefirst electrical contacts 218 in the forward direction.

It should be noted that the illustrations and discussions of theembodiments shown in the figures are for exemplary purposes only, andshould not be construed limiting the disclosure. One skilled in the artwill appreciate that the present disclosure contemplates variousembodiments. For example, while the invention has been generallydescribed in terms of a transceiver, the transmitting element of thetransceiver may be removed to form a receiver. Similarly, the receivingelement of the transceiver may be removed to form a transmitter. Theelectrical compression connector described in above could be replaced byan edge connector, a ZIF (zero insertion force) connector, or any othertype of low profile connector including connectors that reside orpartially reside in the thickness of the host PCB, either in one or morerecesses or cut outs of the host PCB. It should be understood that termssuch as top, bottom, up, down, right, left, sides, vertical, andhorizontal are relative terms and the embodiments described herein canbe used in any orientation. Additionally, it should be understood thatthe concepts described above with the above-described embodiments may beemployed alone or in combination with any of the other embodimentsdescribed above. It should further be appreciated that the variousalternative embodiments described above with respect to one illustratedembodiment can apply to all embodiments as described herein, unlessotherwise indicated.

1. An interconnect module configured to mate with a host module having ahost substrate and first and second pluralities of electrical contactssupported by the host module, the interconnect module comprising: aninterconnect substrate that defines a top and bottom surfaces oppositeeach other along a transverse direction, and front and rear endsopposite each other along a longitudinal direction that is orientedsubstantially perpendicular to the transverse direction; a plurality offirst electrical lands carried by the bottom surface; a plurality ofsecond electrical lands carried by the bottom surface disposed such thatthe first electrical lands are spaced from the second electrical landsin a forward direction that is oriented along the longitudinaldirection; and a first guide member configured to engage a complementarysecond guide member so as to guide the interconnect module to mate witha host module in the forward direction such that 1) the first lands passby the second electrical contacts while spaced from the secondelectrical contacts along the transverse direction, 2) the first landsmate with the first electrical contacts, and 3) the second lands matewith the second electrical contacts.
 2. The interconnect module asrecited in claim 1, comprising a transceiver having an optical enginesupported by the interconnect substrate.
 3. The interconnect module asrecited in claim 1, wherein the first guide member comprises a recessthat extends into a module housing of the interconnect module, therecess configured to receive the second guide member of the host moduleconfigured as a projection so as to guide movement of the interconnectmodule in the forward direction.
 4. The interconnect module as recitedin claim 3, wherein the recess defines a first length, and a secondlength offset from the first length in both a rearward directionopposite the forward direction, and an upward direction away from theinterconnect substrate.
 5. The interconnect module as recited in claim1, further comprising a biasing member that is configured to urge thesecond electrical contacts from a first position whereby mating regionsof the second electrical contacts are offset with respect to matingregions of the first electrical contacts in a downward direction towardthe host substrate, to a second position that is substantially coplanarwith the mating regions of the first electrical contacts after the firstlands pass by the second electrical contacts. 6-7. (canceled)
 8. Aninterconnect system comprising: the interconnect module as recited inclaim 1; the host module as recited in claim 1; and a cage configured tobe supported by a panel, wherein the second guide member is carried bythe cage.
 9. (canceled)
 10. The interconnect system as recited in claim9, wherein the first guide member is a recess defined by a modulehousing that extends from the interconnect substrate, and the secondguide member comprises a projection that is carried by the cage and issized to be received in the recess so as to guide motion of theinterconnect module with respect to the host module. 11-28. (canceled)29. An interconnect module comprising: an interconnect substratedefining a top surface and a bottom surface spaced from the top surfacealong a transverse direction; a module housing supported by theinterconnect substrate, wherein the module housing substantiallysurrounds an optical engine mounted to the interconnect substrate; a rowof a first plurality of electrical lands supported by the bottom surfaceof the interconnect substrate; a row of a second plurality of electricallands supported by the bottom surface of the interconnect substrate at alocation spaced from the row of the first plurality of electrical landsalong a longitudinal direction that is substantially perpendicular tothe transverse direction; wherein the interconnect module is configuredto selectively mate to a host module through a panel and to a mid boardlocation of the host module.
 30. The interconnect module as recited inclaim 29, further comprising a guide member configured to guide theinterconnect module to mate with a host module through a cage, and alatch engagement member configured to receive a latch that secures theinterconnect module to the host module when the interconnect module ismated to the host module at the mid board location.
 31. The interconnectmodule as recited in claim 30, wherein the guide member comprises arecess that extends into the module housing.
 32. The interconnect moduleas recited in claim 30, wherein the latch engagement member comprises arecess that extends into the module housing.
 33. The interconnect moduleas recited in claim 30, wherein the latch engagement member intersectsthe guide member.
 34. The interconnect module as recited in claim 30,wherein the guide member comprises a first length and a second lengthhaving at least a portion that is offset from the first length alongboth the transverse direction and the longitudinal direction.
 35. Theinterconnect module as recited in claim 34, wherein the guide memberfurther comprises a jog that extends from the first length to the secondlength.
 36. The interconnect module as recited in claim 35, wherein thejog extends from a trailing end of the first length to a leading end ofthe second length.
 37. The interconnect module as recited in claim 34,wherein the first and second lengths are oriented substantially alongthe longitudinal direction.
 38. The interconnect module as recited inclaim 35, wherein the jog is oriented substantially along the transversedirection.
 39. The interconnect module as recited in claim 29, whereinthe row of a first plurality of electrical lands is spaced from the rowof a second plurality of electrical lands in a forward direction that isoriented along the longitudinal direction, and the interconnect moduleis configured to mate to the host module such that the first electricallands are configured to mate with a first plurality of electricalcontacts without wiping along a second plurality of electrical contactsof the host module that are spaced from the first plurality ofelectrical contacts in a rearward direction that is opposite the forwarddirection. 40-54. (canceled)
 55. An interconnect module configured tomate in a forward direction with a host module having a host substrateand first and second pluralities of electrical contacts supported by thehost module, the interconnect module comprising: an interconnectsubstrate that defines a top and bottom surfaces opposite each otheralong a transverse direction, and front and rear ends opposite eachother along a longitudinal direction that is oriented substantiallyperpendicular to the transverse direction; a plurality of firstelectrical lands carried by the bottom surface; a plurality of secondelectrical lands carried by the bottom surface disposed such that thefirst electrical lands are spaced from the second electrical lands inthe forward direction that is oriented along the longitudinal direction;wherein the interconnect module is configured to mate with the hostmodule mounted in either a panel mount position or mid board position.56. The interconnect module as recited in claim 55, wherein the firstlands pass over electrical contacts of the host module without wipingagainst the electrical contacts and the second electrical lands matewith the electrical contacts. 57-72. (canceled)